The International Conference on Integrated Power Electronics Systems (CIPS 2024) covers topics such as:
- General aspects of packaging
- Assembly concepts, embedded power, 3D integration
- System and component packaging
- Additive manufacturing
- New materials incl. interface materials and interconnects
- Design for high temperature applications
- High voltage insulation
- Multidomain CAD and design tools
- Cooling concepts
- Components to be integrated
- Wide bandgap devices and monolithic integration
- Advanced silicon devices and monolithic integration
- Passive components
- Gate drivers
- Sensors and actuators
- System and application aspects
- Integration of power electronics into electric machines
- Mechatronic systems and their applications
- Integration with sensors and actuators
- Challenges of fast switching on circuit/system level winding insulation, bearin currents, earth leakage, touch current..
- Overall system optimisation
- Power packages and modules
- Discrete semiconductor packages
- Bare chip packaging
- Power semiconductor modules
- Hermetic semiconductor packages
- Heterogeneous integration, power systeminpackage
- Clean switching, electromagnetic compatibility (EMC)
- Oscillation free design
- Parasitics optimization: electromagnetically optimized design
- Design of drivers for improved switching waveforms
- Symmetric paralleling of power semiconductors
- EMI filter integrations: material, component design, implementation
- EMC interferences reductions: optimized control, active filter and passive filter design
- Integrated sensors and high bandwidth measurement
- Reliability and availability
- Robustness validation, physics of failure, failure analysis
- Reliability requirements, mission profiles
- Intelligent reliability testing
- Modelling and simulation of lifetime
- Fault tolerant designs and applications
- Prognostics and health management
The International Conference on Integrated Power Electronics Systems (CIPS 2024) brings together engineers coming from academia and industry involved in Component development, System development, Research and Reliability engineering.
