ITHERM 2024 - The 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems is a scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.
ITHERM 2024 - The 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems covers topics such as:
- Mechanics
- Failure Mechanics and Damage Modeling
- Modeling and Simulation for Reliability at Board, Package and System Levels
- Constitutive Models
- Experimental Techniques
- Solder Profile Modeling, Fatigue Mechanics of Packages, Interconnects
- Drop, Impact and Vibrational Analysis of Packages, Sub-Systems, and Systems
- Materials: Design, Synthesis and Processing of Materials for Thermal/Thermo-Mechanical Management in Electronic Systems Thermo-mechanical Characterization and Modeling of Packaging Materials Material Interfaces: Engineering, Characterization and Simulation
- Thermal Management
- Natural and Forced Convection Air Cooling
- Novel Materials: Heat Spreaders, Thermal Vias and Thermal Interface Materials
- Single Phase Liquid Cooling
- Advances in Compact Air Movers
- Microfabricated Thermal Management Devices and Systems
- Novel Phase Change Cooling Techniques: Heat Pipes, Boiling, Spray, Thermosyphon and Jet Impingement
- Thermal Management in Networking, Wireless, Lighting, Computing, Peripheral Hardware and Harsh Environments
- Sub-Ambient Cooling: Vapor Compression, Solid State, Adsorption, Absorption, Magnetocaloric and Thermo-acoustic
- Three-Dimensional Electronics
- Thermal and Energy Management in Data Centers
- Advances in Computational Characterization: Compact Modeling, Multi-Scale Modeling, Multi-Objective Design, Multi-Physics Modeling and Optimization
- Advances in Experimental Characterization
- Emerging Technologies
- Nanotechnology: Mechanics, Thermal, Process and Material Related Issues in Nanostructures
- Sensors (Military, Medical, Structures, Consumer and Diagnostic...)
- Fiber-Optics Interconnect Systems & Free Space Optical Interconnects
- Micro-Fluidics
- Integrated Biochips and Bioelectronics
- MEMS: Device and Package Level Reliability Issues
- Space Systems: Earth Orbiting and Deep-Space Missions
- Medical, Telecommunication, and Automotive Systems
